copper clad laminate
Price: |
10.0~12.0 USD |
Payment Terms: |
T/T,L/C,D/P,WU |
Place of Origin: |
Zhejiang, China (Mainland) |
Product Detail
Model No.:
XPC
Production Capacity:
15000pcs one month
Delivery Date:
20 days
Means of Transport:
Ocean
Packing:
case and pallet
peel strength:
min 1.0 N/mm
XPC copper clad laminate is made of phenolic paper laminated sheet, resin and copper foil. It suitable for making PCB in average electronic equipment.
XPC copper clad laminate is made of phenolic paper laminated sheet, resin and copper foil. It suitable
for making PCB in average electronic equipment motor toy and communication equipment.
1,Peel strength Soldering 5s Explored in solvent vapour: min 1.0 N/mm
2,Bubble test after heat punching260℃: Not be divided no bubble
3,Solder Resistance(260℃): 15~30
4,Heat Resistance 130℃30min: no change
GeneralProperties |
TestItem | Unit | Condition | TestingMethod | specification | Typicalvalue |
XPCCCL |
SolderResistance(260℃) | Sec | A | JISC6481 | ≥10 | 15~30 |
HeatResistance | — | 130℃ 30min | JISC6481 | NoChange | NoChange |
PeelStrength (CopperFoil35μm) | kgf/cm | A | JISC6481 | ≥1.2 | 1.2~1.7 |
FlexuralStrength | lengthwise | kgf/mm2 | A | JISC6481 | ≥8 | 14~16 13~14 |
crosswise |
VolumeResistivity | Ω-cm | C-96/20/65 C-96/20/65+C-96/40/90 | JISC6481 | 5×109 5×108 | 1×1012~1013 1×1011~1012 |
SurfaceResistance | AdhesiveSide | Ω | C-96/20/65 C-96/20/65+C-96/40/90 | JISC6481 | 1×1010 1×109 | 1×1011~1012 1×1010~1011 |
LaminateSide | 1×109 1×107 | 1×1010~1011 1×109~1010 |
InsulationResistance | Ω | C-96/20/65 C-96/20/65+D-2/100 | JISC6481 | 1×109 1×106 | 1×1010~1011 1×107~108 |
ChemicalResistance | — | 3%NaOH40℃3min | JISC6481 | Nodelamination Non-foaming |
Boildintrichloroethylenefor3min |
WaterAbsorption | % | E-24/50+D-45/23 | JISC6481 | ≤2 | 1.0~1.5 |
Flammability | Sec | A | UL94 | 94HB | 94HB |
DielectricConstant(1MHz) | — | C-96/20/65 C-96/20/65+D-24/23 | JISC6481 | ≤5.5 ≤6.0 | 4.0~5.0 4.5~5.5 |
DissipationFactor | — | C-96/20/65 C-96/20/65+D-24/23 | JISC6481 | ≤0.05 ≤0.1 | 0.025~0.035 0.035~0.045 |
CTIValue | V | 0.1%NH4CI | IEC112 | ≥150 | 150~200 |
PunchingTemperature | ℃ | A | WI-QA-002 | 50~70 | Ambient~70 |
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