copper clad laminated sheet
Price: |
21.0~23.0 USD |
Payment Terms: |
T/T,L/C,D/P,WU |
Place of Origin: |
Zhejiang, China (Mainland) |
Product Detail
Model No.:
FR4
Production Capacity:
15000pcs one month
Delivery Date:
20 days
Means of Transport:
Ocean
Packing:
case and pallet
Peel strength min 1.4 N/mm:
Dielectric Voltage min 40KV
FR-4 Copper clad laminate is made of epoxy resin, high quality glass cloth and copper foil.
FR4 Copper clad laminate is made of epoxy resin, high quality glass cloth and copper foil. It has excellent
heat resistance, good mechanical & electrical properties, high peel strength and chemical resistance,
Suitable for making flame resistant PCB of
high_grade electronic equipment, computers and other printed circuit boards that required high density and
excellent heat resistance.
Peel strength (35μm copper foil) : min 1.4 N/mm
immerse resistance288℃,20S:no change
Dielectric Voltage:≥40KV
Dielectric Constant (1MHz):≤5.4
GeneralProperties |
TestItem | Unit | Condition | TypicalValue |
FR-4CCL |
Surfaceresistivity | Afterdamp | MΩ | F | ≥104 |
Volumeresistivity | Afterdamp | MΩ.cm | F | ≥106 |
Afterheattreatment | E-24/125 | ≥103 |
DielectricVoltage | KV | D-48/50+D-0.5/23 | ≥40 |
DielectricConstant(1MHz) | | C-40/23/50 | ≤5.4 |
Peelstrength(35μmcopperfoil) | N/mm | A | ≥1.40 |
Immerseresistance | | 288℃,20S | Nodelamination Non-foaming |
| 260℃,20S | -- |
Bendingstrength | Vertical | MPa | A | ≥410 |
Parel. | A | ≥340 |
Waterabsorption | % | E-1/105+des+D-24/23 | 0.10-0.77≤0.80 |
0.78-3.20≤0.35 |
Flammability | | A&E-1/105+des | 94V-0 |
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