copper clad laminate sheet from China manufacturer

Price:	15.0~18.0 USD
Payment Terms:	T/T,L/C,D/P,WU
Place of Origin:	Zhejiang, China (Mainland)


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Product Detail

Model No.: CEM1

Production Capacity: 15000pcs one month

Delivery Date: 20 days

Means of Transport: Ocean

Packing: case and pallet

Peel strength min 1.2 N/mm: Bubble test after heat punc...

CEM1 copper clad laminate is composite of epoxy resin, glass cloth and paper as based material, then covered with copper foil.

CEM1 copper clad laminate is composite of epoxy resin, glass cloth and paper as based material, then
covered with copper foil. It is of heat resistant, excellent dimensional stability after heating, good mechanical
& electrical properties, high peel strength and chemical resistant, Suitable for making flame resistant PCB of high grade electronic equipment and auto-instrument line.

Peel strength Soldering 10s explored in solent vapour At 100℃ : min 1.2 N/mm

Bubble test after heat punching260℃: Not be divided no bubble

Punch ability AT 70℃- 80℃: excellent

Flammability UL94 :FVO

General Properties
TestItem	Unit	Condition	TypicalValue
TestItem	Unit	Condition	CEM-1CCL
Surfaceresistivity(min)	MΩ	Afterconstantdamp-hottreatmentAT100℃	30000 1000
Volumeresistivity(min)	MΩ.m	Afterconstantdamp-hottreatmentAT100℃	5000 100
DielectricConstant(min)		Afterconstantdamp-hottreatment	5.2
DissipationFactor(max)		Afterconstantdamp-hottreatment	0.045
PullStrength(min)	N		60
PeelStrength(min)	N/mm	Soldering10sexploredinsolentvapourAt100℃	1.2 1.2 0.6