copper clad laminate sheets
Price: |
17.0~20.0 USD |
Payment Terms: |
T/T,L/C,D/P,WU |
Place of Origin: |
Zhejiang, China (Mainland) |
Product Detail
Model No.:
CEM3
Production Capacity:
15000pcs one month
Delivery Date:
20 days
Means of Transport:
Ocean
Packing:
case and pallet
Peel strength min 1.31 N/mm:
Dielectric Voltage min 40KV
CEM-3 Copper clad laminate is made of epoxy resin, glass cloth and copper foil.
CEM3 Copper clad laminate is made of epoxy resin, glass cloth and copper foil. It is of heat resistant, good
mechanical & electrical properties, high peel strength and chemical resistant, Suitable for making flame
resistant PCB of high-grade electronic equipment and auto-instrument line.
Peel strength (35μm copper foil) : min 1.31 N/mm
immerse resistance260℃,20S:no change
Dielectric Voltage:≥40KV
Dielectric Constant (1MHz):≤5.4
General properties |
Testitem | Unit | Condition | Spec. | Typicalvalue |
CEM-3CCL |
Tg | ℃ | DSC | ~ | 130 |
Peelstrength | N/mm | 288℃,10s(cu17μm) | 1.05 | 1.5 |
Flammability | ~ | UL94 | V0 | V0 |
Volumeresistivity | MΩ.cm | C-96/35/90 | ≥106 | 2.0×108 |
Surfaceresistivity | MΩ | C-96/35/90 | ≥104 | 2.0×106 |
ArcResistance | S | D-48/50+D-0.5/23 | ≥60 | 135 |
Dielectricbreakdown | kv | D-48/50+D-0.5/23 | ≥40 | 60 |
Dielectricconstant(1MZ) | ~ | C-40/23/50 | ≤5.4 | 4.6 |
DissipationFactor(1MZ) | ~ | C-40/23/50 | ≤0.035 | 0.017 |
Thermalstress(Unetched) | ~ | 288℃,10s | Nodelamination Non-foaming |
Thermalstress(Etched) |
FlexuralstrengthLW | N/mm2 | A | ≥276 | 380 |
FlexuralstrengthCW | ≥186 | 290 |
WaterAbsorption | % | E-1/105+D-24/23 | ≤0.5 | 0.11 |
ComparativeTrackingIndex | V | IEC60112 | | 175~250) |
Remark:C=humiditycondition |
D=immersionconditiondistilledwater |
E=temperaturecondition |
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