FR1 copper clad laminate consists of wood pulp paper, impregnated with flame resistant phenolic resin
and clad with electrolytic copper foil. With high electrical stability, good flame retardancy, good peel strength
and punching ability, Suitable for making flame resistant PCB in colour TV set, VCD recorder, electronic
equipment, instrument, meter. ect.
1,Peel strength Soldering 5s Explored in solvent vapour: min 1.0 N/mm
2,Bubble test after heat punching260℃: Not be divided no bubble
3,Solder Resistance(260℃): 20~30
4,Heat Resistance 130℃30min: no change
TestItem | Unit | Condition | TestingMethod | specification | Typicalvalue |
FR-1CCL |
SolderResistance(260℃) | Sec | A | JISC6481 | ≥10 | 20~30 |
HeatResistance | — | 130℃ 30min | JISC6481 | NoChange | NoChange |
PeelStrength (CopperFoil35μm) | kgf/cm | A 260℃/10Sec | JISC6481 | ≥1.2 | 1.8~2.1 1.8~2.1 |
FlexuralStrength | lengthwise | kgf/mm2 | A | JISC6481 | ≥8 | 14~16 |
crosswise | 13~14 |
VolumeResistivity | Ω-cm | C-96/20/65 C-96/20/65+C-96/40/90 | JISC6481 | 5×109 5×108 | 1×1012~1013 1×1011~1013 |
SurfaceResistance | AdhesiveSide | Ω | C-96/20/65 C-96/20/65+C-96/40/90 | JISC6481 | 1×1010 1×109 | 1×1011~1012 1×1010~1011 |
LaminatcSide | 1×109 1×107 | 1×1010~1011 1×109~1010 |
InsulationResistance | Ω | C-96/20/65 C-96/20/65+D-2/100 | JISC6481 | 1×109 1×106 | 1×1011~1012 1×108~109 |
ChemicalResistance | — | 3%NaOH40℃3min | JISC6481 | Nodelamination Non-foaming |
Boildintrichloroethylenefor3min |
WaterAbsorption | % | E-24/50+D-45/23 | JISC6481 | ≤2 | 0.8~1.0 |
Flammability | Sec | A | UL94 | 94V-0 | V-0 |
DielectricConstant(1MHz) | — | C-96/20/65 C-96/20/65+D-24/23 | JISC6481 | ≤5.5 ≤6.0 | 4.0~5.0 4.5~5.5 |
DissipationFactor | — | C-96/20/65 C-96/20/65+D-24/23 | JISC6481 | ≤0.05 ≤0.1 | 0.025~0.035 0.045~0.055 |
CTIValue | V | 0.1%NH4CI | IEC112 | 200 | 200 |
PunchingTemperature | ℃ | A | WI-QA-002 | 50~70 | Ambient~70 |